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Project Title: Project PW1251231753 — 30 T/H Ultrapure Water System for FAB R&D Cleanroom

Date: 2025-12-01

Project Overview

  • Project Name: Project No. PW1251231753
  • Location: Tehran, Iran
  • System Process: ASS + UF + 2RO + EDI + 2MDG + 2TOC + 3SMB + UF
  • Production Capacity: 30 T/H
  • Water Quality Standard: Semiconductor-grade ultrapure water (18 MΩ·cm class, degassed, low TOC)

Client Profile

The end client operates a semiconductor FAB R&D cleanroom facility in the Middle East, part of the region’s growing investment in semiconductor research and manufacturing. Semiconductor-grade ultrapure water is indispensable for wafer processing and advanced R&D cleanrooms.

In accordance with the client’s confidentiality requirements, the customer name is withheld in this case study and the project is referenced by its contract number.

Technical Note: Process Terms

For your reference, here is a breakdown of the technical process mentioned:

  • ASS: Automatic Softening System — an automated ion-exchange softener that removes hardness from feed water to protect downstream membranes.
  • UF: Ultrafiltration — a membrane filtration stage that removes colloids, bacteria, viruses and fine particles, delivering stable, low-SDI feed water for reverse osmosis.
  • 2RO: Two-stage Reverse Osmosis — two RO passes in series, producing water of significantly higher purity and lower conductivity.
  • EDI: Electrodeionization — a continuous, chemical-free polishing process that combines ion exchange with electrical regeneration to produce high-resistivity water.
  • MDG: Membrane Degasser — a membrane contactor system that removes dissolved gases (such as CO₂ and O₂) from ultrapure water.
  • TOC: TOC Reducer — an ultraviolet oxidation stage that destroys trace organic compounds to keep total organic carbon at ultrapure levels.
  • SMB: Secondary Mixed Bed — a polishing mixed-bed ion exchanger, typically the final stage that lifts water resistivity to 18 MΩ·cm.

Project Location: Tehran, Iran | System process: ASS + UF + 2RO + EDI + 2MDG + 2TOC + 3SMB + UF | Date: 2025-12-01

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