Glass Substrate
TFT LED Panel
OLED
| Parameters | Glass Substrate | TFT-LED Panel | OLED (High-End) |
|---|---|---|---|
| Resistivity (25°C) | ≥ 18.2 MΩ·cm | ≥ 18.2 MΩ·cm | ≥ 18.2 MΩ·cm (UP-SS) |
| TOC (Organic Carbon) | < 1 ppb | < 5 ppb | < 1 ppb (Strict) |
| Particles (≥0.1μm) | < 1 unit/mL | < 5 units/mL | < 1 unit/mL |
| Bacteria Control | < 1 CFU/L | < 10 CFU/L | < 1 CFU/L |
| System Stability | Fluctuation < ±5% | Standard | Fluctuation < ±5% |
| Water Recovery Rate | ≥ 75% | ≥ 75% | ≥ 75% |
| Terminal Filtration | 0.1 μm UF | 0.1 μm UF | 0.05 μm UF (Barrier) |
| Industry Standards | SEMI F63 / UP-SS | SEMI F63 Standard | Electronic Grade (UP-SS) |
The Challenge: The Core Determinant of Panel Yield
Glass substrate production has extreme requirements for water purity, as it is a core factor influencing product yield and performance. In high-end display manufacturing, water is not just a utility but a critical chemical reagent.
- Theoretical Limit Resistivity: To avoid surface defects or uneven etching, resistivity must exceed 18.2 MΩ·cm (25°C), with ionic impurities (Na⁺, K⁺, Cl⁻) controlled at the ppb or even ppt level.
- Ultra-Low TOC (< 1 ppb): Total Organic Carbon must be strictly minimized to prevent organic decomposition during high-temperature or UV processes, which can lead to film adhesion failure.
- Extreme Particle Control: Concentration of particles (≥0.1 μm) must be lower than 1 unit/mL to prevent pinholes, scratches, or lithography defects on the substrate surface.
- Sterile Environment: Bacteria count must be < 1 CFU/L to prevent microbial metabolites from introducing organic films that interfere with coating uniformity.
The Conclusion
“Investing in a high-reliability UPW system is the foundation for competitiveness in high-end display manufacturing. Stable supply with flow/pressure fluctuations < ±5% is critical for maintaining surface flatness and light transmittance."
Our Solution: SEMI-Compliant UPW & High-Recovery Systems
Our targeted solutions for the glass substrate industry follow SEMI F63 international standards, providing Electronic Grade (UP-SS) water.
- Modular UPW Systems: Integrated RO, EDI, and Polishing Mixed Bed technologies ensuring stable 18.2 MΩ·cm output with real-time TOC and particle monitoring.
- High-Efficiency Water Recovery: Our EDI+RO recycling configurations achieve a wastewater recovery rate of ≥75%, significantly reducing production costs and environmental load.
- Advanced Material Selection: We utilize high-polish stainless steel or PVDF piping to eliminate secondary leaching, ensuring zero contamination during water transport.
The Challenge: Balancing Massive Volume with Absolute Purity
TFT-LED manufacturing requires a massive and continuous supply of ultrapure water (UPW) for high-frequency rinsing. Even minor fluctuations in water quality can lead to batch-wide defects in transistor arrays and light transmission.
- Theoretical Limit Resistivity: To prevent conductive anomalies and uneven etching, water must reach 18.2 MΩ·cm (25°C), with ions like Na⁺ and K⁺ controlled at the ppt (parts per trillion) level.
- Nanoscale Surface Integrity: Total Organic Carbon (TOC) must be strictly < 1 ppb to prevent carbon residues during high-temperature UV processes, which would otherwise degrade film adhesion and optical performance.
- Zero-Particle Requirement: Particle concentration (≥0.1 μm) must be lower than 1 unit/mL to eliminate the risk of pinholes, scratches, or photolithography defects on the substrate.
The Conclusion
“In the TFT-LED industry, the UPW system is not just a utility but a core process factor. Maintaining stable flow and pressure (fluctuation < ±5%) while achieving a wastewater recovery rate ≥ 75% is essential for both yield and sustainability."
Our Solution: High-Yield Modular UPW & Recovery Systems
Our solutions for TFT-LED lines focus on the SEMI F63 standard, ensuring Electronic Grade (UP-SS) water through closed-loop control.
- Integrated Process Chain: We combine Pre-treatment, RO, EDI, and Polishing Mixed Beds with 185nm UV sterilization to guarantee stable 18.2 MΩ·cm output.
- Sustainable Water Cycle: Our high-efficiency recovery systems utilize advanced EDI+RO configurations to achieve a waste-to-pure recovery rate of ≥75%, significantly reducing environmental impact.
- High-Purity Piping & Monitoring: We utilize PVDF or highly polished stainless steel piping to eliminate secondary leaching, paired with real-time TOC and particle monitoring for full-process traceability.
| Indicators | OLED Target Value | Critical Impact |
|---|---|---|
| Resistivity (25°C) | ≥ 18.2 MΩ·cm | Eliminates electrical leakage between pixels |
| TOC (Total Organic Carbon) | < 50 ppb | Prevents organic layer contamination/dark spots |
| Metal Ions | < 0.001 μg/L | Prevents chemical degradation of emissive layers |
| Particle Size (Terminal) | ≤ 0.05 μm | Ensures integrity of the encapsulation barrier |
